CIOE 2024 was grandly opened in Shenzhen World Exhibition & Convention Center on September 10. Accelink presented the theme of "AI FOR ALL, AI FOR NEW CONNECTION" at Booth B53, Hall 11, bringing a number of global debut products to the exhibition. As an enterprise with more than 45 years of deep cultivation in the industry,the booth attracted thousands of partners to visit.
Accelink unveiled its new generation of 1.6T OSFP224 DR8 high-end optical transceiver for AI computing power with excellent performance. It showed the mass delivery capability of 800G DR8 series optical transceiver, supporting the foundation of intelligent datacenter.
The world's first 50G Tri-Mode Combo OLT SFP-DD miniaturized optical transceiver was also unveiled, which would accelerates the upgrade of FTTx network bandwidth to 10 gigabits. Accelink also released the upgraded OCM module with ultra-high resolution optical channel monitoring. This world-leading integrated portable optical fiber sensing analyzer could help customers to achieve intelligent operations with scientific and technological innovation. The joint demonstration of L-band 400G DCO module and C-band 100ZR/800ZR miniaturized pluggable coherent module C+L hybrid solution was also carried out at the site, which received wide attention from the partners.
Accelink displayed a large number of products, from optical chips to optical devices to optical modules, showing the optoelectronic one-stop shop capabilities in an intuitive way. The "exhibit wall" displayed more than 30 lasers, detectors and PLC chips which attracted the attention of the visitors. It included 10G to 400G to 800G to 1.6T full series transceivers, which meet the datacom AI, transmission, wireless, fixed network and other application scenarios such as C+L, pluggable function, and coherent requirements.
During the exhibition, the theme video "AI Chip, New Connection, New Future" generated by AI was also launched, which presented the core competitiveness of Accelink and its aspiration to constantly meet customer needs with continuous technology innovation.